Pulp board · Arch frame · Press seal

G+OCA Pro XLY-001 Camera Ring Screen IC Grinding Polish Platform Option:XLY-001 Standard+1pcs Camera Knife WL HT007 motherboard layered soldering

Name: G+OCA Pro XLY-001 Camera Ring Screen IC Grinding Polish Platform Option:XLY-001 Standard+1pcs Camera Knife WL HT007 motherboard layered soldering
Brand: www.aandoandb.com
SKU: 73611998956
Price: 55.99 USD
Availability: InStock
Rating: 4.855 (15 reviews)

SKU 73611998956 Atelier www.aandoandb.com

Press price

USD55.99 USD99.99

Pay in 4 interest-free payments of $14.00 Learn more

Studio score

4.9

Ink-checked · Current pulp lot

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Ships within 48 hours · Estimated delivery Oct 4 - Oct 9

G+OCA Pro XLY-001 Camera Ring Screen IC Grinding Polish Platform Option:XLY-001 Standard+1pcs Camera Knife WL HT007 motherboard layered soldering

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Description

G+OCA Pro XLY 001 Camera Ring Screen IC Grinding Polish Platform Option:XLY 001 Standard+1pcs Camera Knife WL HT007 motherboard layered soldering WL HT007 motherboard layered soldering station with iPhone X 11 12 13 14 15 16 17 Pro Max heating module for motherboard separation and soldering repair Applicable chips

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